Taiwan Semiconductor Manufacturing Company (TSMC) plans to spend another $100 billion in the U.S. to build more chip facilities, the company announced Thursday.

The chipmaker’s investment will be directed toward constructing several more semiconductor and advanced packaging fabrication plants in Arizona “to support the strong multiyear demand from our leading U.S. customers,” TSMC CEO C.C. Wei said on a quarterly earnings call.

The multibillion-dollar commitment aims to “further foster the development of the U.S. semiconductor ecosystem, strengthen the supply chain and support an increasing number of high-tech, high paying jobs in the United States,” Wei added.

It comes on top of $165 billion the company has already pledged to spend in the U.S. TSMC first announced plans in 2020 to invest $65 billion in building a series of plants in Arizona. Last March, Wei joined President Trump at the White House to unveil another $100 billion in U.S. spending over a four-year period.

Trump touted the commitment at the time, saying it would “create hundreds of billions of dollars in economic activity and boost America’s dominance and artificial intelligence and beyond.”

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